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Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

AgencyNATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Solicitation #80NSSC26939631Q
Posted2026-08-10
Response Deadline2026-08-12
NAICS Code813920
Set-AsideNone
Point of Contactkacey Hickman <kacey.l.hickman@nasa.gov>
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