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Semiconductor Die Bonding and Vacuum Packaging System

AgencyDEPT OF DEFENSE
Solicitation #N00173-26-RFI-KN02
Posted2026-06-16
Response Deadline2026-07-01
Set-AsideNone
Place of PerformanceDistrict of Columbia
Point of ContactKEVIN NGUYEN <kevin.nguyen3.civ@us.navy.mil>
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